The new Semiconductor Packaging education program that was developed by Hogeschool Arnhem en Nijmegen (HAN) and Chip Integration Technology Center (CITC) has launched. The education program closes the gap between study and work. The launch of the course is a big step forward for CITC.
Heterogeneous integration and advanced packaging—stacking and packaging of chips—is essential for connecting chips and protecting them. CITC develops new technology to make the chip shell smaller, better and cheaper. The innovation center thus plays an important role in smartphones, cars and operating room of the future, for example.