News item

Start of new Semiconductor Packaging University Program

Together with HAN University of Applied Sciences, CITC developed the Semiconductor Packaging University Program. The program provides a connection between education and industry and as such contributes

to the training and skills of people that align with industry needs. People who are in high demand – now and in the future. The third edition of the program will begin on August 29, 2022. Registration is possible until July 1.

Read more in the brochure.

Share this news

Share on facebook
Share on twitter
Share on linkedin

Subscribe the NTC Newsletter

We care about your privacy: Read more

Settle at Novio Tech Campus!

Connect with Novio Tech Campus!