Semiconductor Packaging University Program – Edition 2021-2022

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Together with the HAN University of Applied Sciences, CITC offers a Semiconductor Packaging University Program tailored to the specific needs of companies involved. This course, with a duration of about 5 months, enables students and company employees to get training in all relevant aspects in the field of packaging, both theoretical and practical. The second edition starts September 2021.

Learn more about integrated chip technology and its applications
In the Semiconductor Packaging program you will get acquainted with the semiconductor industry and delve into the final step of chip manufacturing, the phase in which the chip is ‘packaged’ in its housing. Packaging is becoming more and more complex and multidisciplinary. Developments such as system-on-chip, embedded cameras, 5G, sensors and micro-electro-mechanical systems (MEMS) place high demands on the manufacturing process and the competencies of affected employees. Packages are becoming more complicated and application specific, while costs must be kept low.

Semiconductor packaging

This education program focuses on the design and manufacturing of semiconductor packages and the associated assembly, reliability and test techniques. It includes a practical assignment that will be carried out on the premises of either a Semiconductor company or CITC. The program is developed through collaboration between HAN University of Applied Sciences, CITC and its partners NXP, Nexperia, Ampleon, TU Delft and TNO.

Find out more information.

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