Date: March 18th, 2025
Time: 12:00 – 13:45 (Lunch included)
Location: Noviotech Campus, Building M, Meet&Greet
We invite you to the 4th edition of Meeting Your Peers for Engineers! All engineers from semiconductor companies in the region are welcome to this lunch event.
This time, NXP will share insights into their company, including their latest innovations in semiconductor technology, with a focus on thermal die attach materials and their performance and reliability in semiconductor packages.
The Die Attach consortium has been working since 2009 on the replacement of Pb-containing solder as die attach and clip attach material in semiconductor packages. The DA5 member companies work closely with die attach material suppliers to tackle technical challenges such as delamination, thermal management and issues related to the die attach process. More information can be found here.
Lunch will be provided, courtesy of NXP, the event's lunch sponsor.
Program
12:00 – 12:30 Walk in & Lunch
12:30 – 12:40 Presentation: Semiconductor Package Development at NXP by Pascal Oberndorff (Sr. Director, NXP Semiconductors)
12:40 – 13:40
In-depth presentation:
Die Attach 5 consortium (Andrei Damian, Package Development engineer, NXP)
13:40 –13:45 Wrap-up & End
Register
Seize the opportunity to network and expand your knowledge! Reserve your spot for this inspiring session on March 18th.
