Inverstering van €1.25 – €2 miljoen voor photonics cluster binnen CITC

The combination of new photonics chips with existing electronics chips creates major challenges in the integration and packaging of chips. By integrating these technologies on one chip, the necessary bridge can be created between light and electricity on one chip. In the CITC the knowledge and experience that has been gained over the last 50 years, in the field of chip integration and chip packaging in the Dutch semiconductor industry, comes together and will be used to help solve these challenges even faster.

 

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