New Semiconductor Packaging University Program

Together with HAN University of Applied Sciences, CITC developed the Semiconductor Packaging University Program. The program provides a connection between education and industry and as such contributes

to the training and skills of people that align with industry needs. People who are in high demand – now and in the future. The third edition of the program will begin on August 29, 2022. Registration is possible until July 1.

Read more in the brochure.