Power Packaging Virtual Forum
Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Save the date in your agenda today and let’s meet online on November 24 and December 1, 2020!
How packaging energizes the needs of power applications
Power electronics play a major role in today’s fast-paced world. Its key driving factors include electrical power-conversion optimization and expansion, driven by electrification trends in transportation, CO2 emission reduction goals, the development of clean electricity sources, and industrialization.
Choosing the right packaging solution is obviously key for power-related applications where reliability and safety play a major role.
Due to stronger requirements, a higher added-value for customers, and a greater desire for competitive differentiation, most innovative packaging solutions focus on power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). Whereas in the past packaging needs were driven by industrial applications, today they are increasingly driven by electric and hybrid electric vehicles (EV/HEV). Hence, power module packaging solutions are moving towards high-performance materials and a reduction in the number of layers, size, and interfaces – all while conserving electrical, thermal, and mechanical characteristics.
Intended topics for the Power Packaging Forum are:
> High thermal performance die-attach
> Packaging technology for power electronics
> New materials and technologies for power packaging
> Global developments affecting power packaging technology
- 24, November, 2020
- 14:00 - 17:00