High Tech Network Meeting: advanced packaging with Sencio

18 / 01 / 19

On the 18th of January the next High Tech Network Meeting takes place. This time Sencio will introduce us to the world of advanced packaging, and more!

 

The program of this meeting is as follows:

11.30 – 11.45: Walk In

11.45 – 12.00: Presentation on the Chip Integration Technology Center (CITC)by Barry Peet (Managing Director BCSEMI NL)

12.00 – 12.30: Lunch

12.30 – 12.45: Presentation/introduction on advanced packaging, by Ignas van Dommelen (CSO Sencio).
12.45 – 13.30: Guided tour at Sencio, in Building A.

 

Of course, lunch will be served.

 

Please feel free to invite relevant colleagues.

 

High Tech Network Meeting: advanced packaging with Sencio

18 / 01 / 19

On the 18th of January the next High Tech Network Meeting takes place. This time Sencio will introduce us to the world of advanced packaging, and more!

 

The program of this meeting is as follows:

11.30 – 11.45: Walk In

11.45 – 12.00: Presentation on the Chip Integration Technology Center (CITC)by Barry Peet (Managing Director BCSEMI NL)

12.00 – 12.30: Lunch

12.30 – 12.45: Presentation/introduction on advanced packaging, by Ignas van Dommelen (CSO Sencio).
12.45 – 13.30: Guided tour at Sencio, in Building A.

 

Of course, lunch will be served.

 

Please feel free to invite relevant colleagues.

 

Event information

Date:
18, January, 2019
Time:
11:30 - 13:30
Where:
Novio Tech Campus, Meet & Greet