High Tech Network Meeting: advanced packaging with Sencio
On the 18th of January the next High Tech Network Meeting takes place. This time Sencio will introduce us to the world of advanced packaging, and more!
The program of this meeting is as follows:
11.30 – 11.45: Walk In
12.00 – 12.30: Lunch
12.30 – 12.45: Presentation/introduction on advanced packaging, by Ignas van Dommelen (CSO Sencio).
12.45 – 13.30: Guided tour at Sencio, in Building A.
Of course, lunch will be served.
Please feel free to invite relevant colleagues.
- 18, January, 2019
- 11:30 - 13:30
- Novio Tech Campus, Meet & Greet
Reservations for this event are closed